Adlink CoreModule 430 Bedienungsanleitung PDF herunterladen (Seite 14)

Chapter 2 Product Overview

8 Reference Manual CoreModule 430

Major Components (ICs)

Table 2-1 describes the major integrated circuits (ICs) on the CoreModule 430, and Figure 2-3 shows the

locations of the major ICs on the board.

Table 2-1. Major Components (Chips) Descriptions and Functions

Chip Type Mfg. Model Description Function

CPU (U1) DMP

Electronics,

Inc.

Vortex 86SX/DX x86 32-bit processor Integrates

Processor Core,

Memory

Controller, and

I/O Hub

PCI

Graphics

Controller

(U13)

SiS

Corporation

Volari Z9S PCI graphics controller Integrates 2D

Engine and PCI

controller

DDR2

System

Memory

(U2 and U3)

Fluctuating Fluctuating On-board DDR2

128Mx8 System

memory

Provides high-

speed data

transfer

DDR2

Video

Memory

(U14)

Fluctuating Fluctuating On-board DDR2

32Mx16 Video memory

Provides high-

speed data

transfer

RS232

Transceiver

(U4 - on

back of the

board)

Analog

Devices

ADM213EARSZ RS232 Transceiver for

COM3

Transmits and

receives RS232

signals for COM3

RS232

Transceiver

(U5)

Analog

Devices

ADM213EARSZ RS232 Transceiver for

COM4

Transmits and

receives RS232

signals for COM4

SPI Flash

(U6)

Winbond W25Q16BV Serial Peripheral

Interface 16 Mbit Flash

Memory

Stores data in

flash memory,

emulating a

floppy drive

RS232

Transceiver

(U7)

Analog

Devices

ADM213EARSZ RS232 Transceiver for

COM1 and COM2

Transmits and

receives RS232

signals for COM1

and COM2

RS422/485

Transceiver

(U9 - on

back of the

board)

Linear LTC1334CG#PBF RS422/485 Transceiver

for COM1 and COM2

Transmits and

receives

RS422/485

signals for COM1

and COM2

Ethernet

Transfomer

(U12)

Pulse H1102NL-T 10/100BaseT Ethernet

Magnetics

Provides

electrical isolation

for Ethernet

controller

contained in the

CPU

1 2 ... 9 10 11 12 13 14 15 16 17 18 19 ... 55 56

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